Qualcomm Multiple Chipsets Use-After-Free Vulnerability

Multiple Qualcomm chipsets contain a use-after-free vulnerability due to memory corruption in DSP Services during a remote call from HLOS to DSP.

Added to CISA’s Known Exploited Vulnerabilities catalog on 2023-12-05. Required action per CISA: Apply remediations or mitigations per vendor instructions or discontinue use of the product if remediation or mitigations are unavailable. Due date: 2023-12-26.

This is an auto-synced KEV catalog record pending a full 0dayNews write-up — see CISA’s KEV catalog and the NVD record linked above for primary sources.